IEEE Technical Co-Sponsors

IEEE Conference Sponsorship Guidelines

QCE20 VirtualA Big Thank You!

The organizers of IEEE Quantum Week 2020 sincerely thank all our IEEE Technical Co-Sponsors for supporting our mission of building a premier meeting series of quantum minds and advance quantum computing, engineering, and technology. We deeply appreciate your leadership, support, and investment in the inaugural IEEE International Conference on Quantum Computing and Engineering (QCE).

IEEE TEMS SocietyThe IEEE Technology and Engineering Management Society (TEMS) encompasses the management sciences and practices required for defining, implementing, and managing engineering and technology. Specific topics of interest include, but are not limited to: technology policy development, assessment, and transfer; research; product design and development; manufacturing operations; innovation and entrepreneurship; program and project management; strategy; education and training; organizational development and human behavior; transitioning to management; and the socioeconomic impact of engineering and technology management. TEMS was founded in 1951 as the Engineering Management Society (EMS), in 2007 became the Technology Management Council (TMC), and in 2015 transitioned to the Technology and Engineering Management Society (TEMS).

IEEE Electronics Packaging Society

The IEEE Electronics Packaging Society (EPS) is the leading international forum for scientists and engineers engaged in the research, design and development of revolutionary advances in microsystems packaging and manufacturing. The field of interests includes the scientific, engineering, and production aspects of materials, components, modules, hybrids and micro-electronic systems for all electronic applications, which includes technology, selection, modeling/simulation, characterization, assembly, interconnection, packaging, handling, thermal management, reliability, testing/control of the above as applied in design and manufacturing. Examples include optoelectronics and bioelectronic systems packaging, and adaptation for operation in severe/harsh environments. Emphasis is on research, analysis, development, application and manufacturing technology that advance state-of-the-art within this scope.